Structure and method for temporarily holding integrated circuit chips in accurate alignment
US7112467B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2004 |
| Grant date | Sep 26, 2006 |
| Priority date | — |
| Expiry date | Nov 15, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4007
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Structure and method for temporarily holding at least one integrated circuit chip during packaging thereof are presented. A support plate has a release film secured to a main surface thereof. The support plate and release film allow UV light to pass therethrough. A UV curable chip adhesive is disposed over the release film for holding the at least one integrated circuit chip. After placement of the at least one integrated circuit chip in the UV curable chip adhesive, the UV curable chip adhesive is cured by UV light shone through the support plate and release film. As one example, the release film includes a UV release adhesive and the UV curable chip adhesive and UV release adhesive have a differential response to UV light which allows curing of the UV curable chip attach without release of the UV release adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.