Epic Technologies, Inc.
20Patents
11Active
20Granted
46Portfolio score
Filing activity: May 14, 1991 → Dec 22, 2009 · 8 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5841193A | Single chip modules, repairable multichip modules, and methods of fabrication thereof | Emerging Cross-Sectional Technologies | 550 | Expired |
| US7619901B2 | Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system | Emerging Cross-Sectional Technologies | 382 | Active |
| US6159767A | Single chip modules, repairable multichip modules, and methods of fabrication thereof | Emerging Cross-Sectional Technologies | 223 | Expired |
| US6396148B1 | Electroless metal connection structures and methods | Electricity | 200 | Expired |
| US6555908B1 | Compliant, solderable input/output bump structures | Electricity | 131 | Expired |
| US5285189A | Abnormal tire condition warning system | Physics | 99 | Expired |
| US6818544B2 | Compliant, solderable input/output bump structures | Electricity | 96 | Expired |
| US6426545B1 | Integrated circuit structures and methods employing a low modulus high elongation photodielectric | Electricity | 90 | Expired |
| US7112467B2 | Structure and method for temporarily holding integrated circuit chips in accurate alignment | Electricity | 85 | Expired |
| US5559484A | Data logging tire monitor with condition predictive capabilities and integrity checking | Physics | 53 | Expired |
| US8169065B2 | Stackable circuit structures and methods of fabrication thereof | Electricity | 51 | Active |
| US8474133B2 | Method of fabricating a base layer circuit structure | Emerging Cross-Sectional Technologies | 43 | Active |
| US7863090B2 | Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system | Emerging Cross-Sectional Technologies | 30 | Active |
| US8324020B2 | Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system | Emerging Cross-Sectional Technologies | 24 | Active |
| US7830000B2 | Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system | Emerging Cross-Sectional Technologies | 20 | Active |
| US7868445B2 | Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer | Emerging Cross-Sectional Technologies | 17 | Active |
| US8564119B2 | Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system | Emerging Cross-Sectional Technologies | 14 | Active |
| US8533941B2 | Method of bonding two structures together with an adhesive line of controlled thickness | Emerging Cross-Sectional Technologies | 13 | Active |
| US8590145B2 | Method of fabricating a circuit structure | Emerging Cross-Sectional Technologies | 12 | Active |
| US8384199B2 | Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system | Emerging Cross-Sectional Technologies | 12 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.