Patent · US Expired

Nonvolatile memory device and method of manufacturing the same

US7112842B2 · kind B2 · utility

2Cited by
3References
8Claims
0Family size

Assignees

Inventors

Key dates

Filing dateOct 29, 2004
Grant dateSep 26, 2006
Priority date
Expiry dateOct 29, 2024

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D30/6893
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

Provided are a nonvolatile memory device and a method of manufacturing the same. The device includes a semiconductor substrate; a source region and a drain region disposed in the semiconductor substrate and a channel region interposed between the source and drain regions; a first tunnel oxide layer disposed on the channel region near the source region; a second tunnel oxide layer disposed on the channel region near the drain region; a first charge trapping layer disposed on the first tunnel oxide layer; a second charge trapping layer disposed on the second tunnel oxide layer; a blocking oxide layer covering the first and second charge trapping layers; a charge isolation layer interposed between the first and second charge trapping layers; and a gate electrode disposed on the blocking oxide layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.