Component holding head, component mounting apparatus using same, and component mounting method
US7114245B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 26, 2002 |
| Grant date | Oct 3, 2006 |
| Priority date | — |
| Expiry date | May 12, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component holding head, an electronic component mounting apparatus using same, and a method for mounting an electronic component, are provided for use in mounting an electronic component having a positioning mark formed on a film member. The electronic component holding head has a main electronic component holding unit, a vacuum chucking part facing the surface of the electronic component to be held by vacuum chucking so as to hold the electronic component, and a light path for guiding light shined onto a positioning mark formed at an edge part of the electronic component for the purpose of correcting a position offset between the electronic component and the substrate to which the electronic component is to be mounted, the vacuum chucking part holding the electronic component at a position which is on a straight line substantially parallel to an edge of the electronic component and substantially mutually orthogonal over the positioning mark of the electronic component, and which avoids the positioning mark.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.