Substrate inspecting method and substrate inspecting apparatus using the method
US7114249B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 26, 2004 |
| Grant date | Oct 3, 2006 |
| Priority date | — |
| Expiry date | Feb 26, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Inspection a is executed between a step B of mounting a chip component by a high-speed mounter and a step C of mounting a odd-shaped component by a odd-shape mounter. The inspection a executes not only mounted component inspection for determining a mounted state of a chip component mounted in the preceding step but also component fly inspection for determining whether a chip component is flown to a position where a odd-shaped component is mounted in the next step C. It is possible to execute the component fly inspection in accordance with a condition corresponding to the situation of an actual spot such as a case in which it is detected that a component is missing in mounted component inspection or a case in which the replacement date of an attracting nozzle in a high-speed mounter is approaching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.