Wafer bake apparatus
US7115840B2 · kind B2 · utility
2Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2005 |
| Grant date | Oct 3, 2006 |
| Priority date | — |
| Expiry date | Aug 19, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer bake apparatus includes an air flow control unit of pneumatic cylinder structure operating interlockingly with a wafer lift unit and induces the air flow between a wafer and a hot plate. Therefore, when a wafer is placed in a baking position the air between the wafer and the hot plate descends. As a result, the wafer is no longer under the influence of air resistance, and can be more accurately placed in the baking position. In addition, when the baked wafer is lifted to an unloading position, the air between the hot plate and the wafer ascends, which in turn supports the wafer and prevents the distortion of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.