Package Structure
US7115978B2 · kind B2 · utility
4Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2004 |
| Grant date | Oct 3, 2006 |
| Priority date | — |
| Expiry date | Oct 6, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure includes a lead frame having a plurality of leads, each of which includes a first recession, at least a first device, and a plurality of solder joints respectively positioned in the first recessions for connecting the first device to the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.