Structural reinforcement of highly porous low k dielectric films by Cu diffusion barrier structures
US7115995B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 22, 2002 |
| Grant date | Oct 3, 2006 |
| Priority date | — |
| Expiry date | May 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76807
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Highly porous, low-k dielectric materials are mechanically reinforced to enable the use of these low-k materials as intralayer and interlayer dielectrics in advanced integrated circuits such as those which incorporate highly porous materials in a Cu damascene interconnect technology. An integrated circuit, embodying such a mechanically reinforced dielectric layer generally includes a substrate having interconnected electrical elements therein, a copper-diffusion barrier or etch stop layer disposed over the substrate, the copper-diffusion barrier or etch stop layer being patterned so as to provide a plurality of electrically insulating structures, and a low-k dielectric layer disposed around the plurality of structures. A process, for making a mechanically reinforced, highly porous, low-k dielectric layer, generally includes forming a copper-diffusion or etch stop layer on a substrate, patterning the copper-diffusion or etch stop layer such that a plurality of structures are formed, the structures each having a top surface, forming a low-k dielectric layer over and adjacent to the structures, the low-k dielectric layer having a top surface, and polishing the low-k dielectric layer s…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.