Smooth pads for CMP and polishing substrates
US7118461B2 · kind B2 · utility
3Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2003 |
| Grant date | Oct 10, 2006 |
| Priority date | — |
| Expiry date | Apr 29, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Pads and methods of making the pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided. The pads include a substantially smooth surface for improved performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.