Guangwei Wu
10Patents
4h-index
12Co-inventors
53Inventor score
Filing activity: May 20, 1997 → Jun 30, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5770103A | Composition and method for polishing a composite comprising titanium | Electricity | 41 | Expired |
| US6001269A | Method for polishing a composite comprising an insulator, a metal, and titanium | Electricity | 28 | Expired |
| US9162341B2 | Chemical-mechanical planarization pad including patterned structural domains | Performing Operations; Transporting | 15 | Active |
| US8684794B2 | Chemical mechanical planarization pad with void network | Performing Operations; Transporting | 15 | Active |
| US7118461B2 | Smooth pads for CMP and polishing substrates | Performing Operations; Transporting | 3 | Expired |
| US8758659B2 | Method of grooving a chemical-mechanical planarization pad | Performing Operations; Transporting | 1 | Active |
| US9796063B2 | Multi-layered chemical-mechanical planarization pad | Performing Operations; Transporting | 0 | Active |
| US8435099B2 | Chemical-mechanical planarization pad including patterned structural domains | Performing Operations; Transporting | 0 | Active |
| US8790165B2 | Multi-layered chemical-mechanical planarization pad | Performing Operations; Transporting | 0 | Active |
| US8377351B2 | Polishing pad with controlled void formation | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.