Enhancement of underfill physical properties by the addition of thermotropic cellulose
US7119449B2 · kind B2 · utility
4Cited by
10References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2003 |
| Grant date | Oct 10, 2006 |
| Priority date | — |
| Expiry date | Dec 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An electrical component having improved impact resistance and improved tolerance for thermal cycling, without sacrificing high-temperature performance, and without requiring unconventional and expensive manufacturing techniques includes an electric device mounted on a substrate circuit board, and a composite material underfilling, overmolding or encapsulating the electronic device, wherein the composite material includes a thermoset matrix phase and a discontinuous liquid crystal polymer phase dispersed throughout the thermoset matrix phase.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.