IC card and method of manufacturing the same
US7120029B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 24, 2003 |
| Grant date | Oct 10, 2006 |
| Priority date | — |
| Expiry date | Jun 4, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a second case, a planar outline of the memory body is smaller than half of a planar outline of the memory card. The memory body is disposed so as to be positioned closer to a first end side as one short side of the memory card with respect to a midline between the first end side and a second end side as an opposite short side of the memory card positioned on the side opposite to the first end side. The other area than the memory body-disposed area in the first and the second case is used as another functional area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.