Apparatus for mounting semiconductors
US7120995B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 3, 2004 |
| Grant date | Oct 17, 2006 |
| Priority date | — |
| Expiry date | Nov 19, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T74/20354
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for mounting semiconductors contains a bonding station, whereby the bonding station comprises a wafer table for presenting the semiconductor chips, a substrate table and a pick and place system with a bondhead with a chip gripper. Part of the wafer table is located underneath the substrate table. The pick and place system has a first linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a first direction guided by first guide elements, and a second linear motor that comprises a rigidly arranged stator and a shuttle that can be moved in a second direction. The shuttle of the first linear motor has second guide elements that guide the shuttle of the second linear motor. The bondhead with the chip gripper is arranged on the shuttle of the second linear motor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.