Patent · US Expired

Method and device for applying material to a workpiece

US7121449B2 · kind B2 · utility

7Cited by

6References

17Claims

0Family size

Assignee

Pac Tech—Packaging Technologies Gmbh · DE

Inventors

Elke Zakel · Falkensee, DE
Paul Kasulke · Berlin, DE
Oliver Uebel · Berlin, DE
Lars Titerle · Berlin, DE

Key dates

Filing date	Oct 2, 2001
Grant date	Oct 17, 2006
Priority date	—
Expiry date	Jun 4, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/3478
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

In order to apply solder material (20) to a workpiece (1), compressed gas is guided through a bore hole (5) of a capillary (3). A pressure sensor (13) situated in the bore hole (5) measures the dynamic pressure of the compressed gas. As soon as the tip (12) of the capillary approaches the workpiece (1), the dynamic pressure increases and is used as a measure for the distance between the tip (12) of the capillary (3) and the workpiece (1), enabling the feed motion of the capillary to be controlled.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.