Method for fabricating window ball grid array semiconductor package
US7122407B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2004 |
| Grant date | Oct 17, 2006 |
| Priority date | — |
| Expiry date | Apr 12, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a window ball grid array (WBGA) semiconductor package is provided. A substrate is prepared having a through opening and ball pads on a lower surface thereof. A chip is mounted over the opening of the substrate via an adhesive, with gaps not applied with the adhesive left between the chip and substrate. The chip is electrically connected to the substrate via bonding wires through the opening. A spacer is attached to the lower surface of the substrate and has a through hole and a recessed portion around the through hole. During molding, the spacer is clamped between the substrate and a mold, and the recessed portion is located between the ball pads and the opening, such that a resin material for forming an encapsulation body encapsulates the chip and flows through the gaps to encapsulate the bonding wires. The recessed portion holds resin flash therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.