Sealing porous dielectrics with silane coupling reagents
US7122481B2 · kind B2 · utility
8Cited by
5References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2003 |
| Grant date | Oct 17, 2006 |
| Priority date | — |
| Expiry date | Dec 15, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76826
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and structure for sealing porous dielectrics using silane coupling reagents is herein described. A sealant chain (silane coupling reagent) is formed from at least silicon, carbon, oxygen, and hydrogen and exposed to a porous dielectric material, wherein the sealant chain reacts with a second chain, that has at least oxygen and is present in the porous dielectric defining the pores, to form a continuous layer over the surface of the porous dielectric.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.