Integrated circuit temperature sensing device and method
US7123037B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 17, 2004 |
| Grant date | Oct 17, 2006 |
| Priority date | — |
| Expiry date | Aug 17, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K1/16
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated circuit (IC) temperature sensing device includes a temperature sensor positioned within a conductive temperature sensor housing and a thermal insulator surrounding the conductive temperature sensor housing. The sensor housing and thermal insulator are positioned within an IC temperature control block that heats or cools the IC. The temperature sensor housing comes into thermal contact with an IC undergoing burning-in, testing or programming. The temperature sensor housing provides a short thermal path between the IC under test and the temperature sensor. The thermal insulator thermally isolates the temperature sensor from the temperature control block so that the temperature sensor predominantly measures the temperature of the IC. The method of sensing the temperature of an IC includes actively changing the temperature of an IC with a heater or cooler, sensing the temperature of the IC with a temperature sensor positioned within a conductive sensor housing in thermal contact with the IC and thermally insulating the sensor housing and temperature sensor from the heater or cooler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.