Extended thin film capacitor (TFC)
US7123466B2 · kind B2 · utility
4Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2005 |
| Grant date | Oct 17, 2006 |
| Priority date | — |
| Expiry date | Aug 27, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Extending high k material of a second dielectric layer to surround at least one thru-via designed to provide a signal other than a power signal to a die may eliminate discrete AC coupling capacitors to reduce cost and improve performance of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.