Ping Sun
8Patents
4h-index
12Co-inventors
46Inventor score
Filing activity: Jun 6, 2002 → Jul 12, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6710461B2 | Wafer level packaging of micro electromechanical device | Electricity | 57 | Expired |
| US7100135B2 | Method and system to evaluate signal line spacing | Physics | 12 | Expired |
| US7027289B2 | Extended thin film capacitor (TFC) | Electricity | 9 | Expired |
| US7110263B2 | Reference slots for signal traces | Electricity | 9 | Expired |
| US7123466B2 | Extended thin film capacitor (TFC) | Electricity | 4 | Expired |
| US7348661B2 | Array capacitor apparatuses to filter input/output signal | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7421673B2 | Design checks for signal lines | Physics | 1 | Active |
| US7421672B2 | Checks for signal lines | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.