Apparatus and method for removing a CMP polishing pad from a platen
US7125326B2 · kind B2 · utility
6Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2005 |
| Grant date | Oct 24, 2006 |
| Priority date | — |
| Expiry date | Jun 13, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/20
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention provides a pad removal apparatus and method that enables improved pad removal from a platen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.