Method of effecting heating and cooling in reduced pressure atmosphere
US7126087B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2004 |
| Grant date | Oct 24, 2006 |
| Priority date | — |
| Expiry date | Aug 6, 2024 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27D19/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A method of effecting high temperature vacuum heating and cooling suitable for conducting heat treatment to be performed on components used in a display apparatus. The heating/cooling method includes the steps of: heating a plate-like member placed in a reduced pressure atmosphere in a chamber by heating means opposed to the plate-like member; and cooling the plate-like member by a cooling plate which is opposed to the plate-like member, with the heating means therebetween, the cooling plate having a heat reflecting function. The cooling plate has an emissivity of not less than 0.50 but not more than 0.80 so as to minimize a sum of a requisite time for the heating step and a requisite time for the cooling step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.