Semiconductor electronic device and method of manufacturing thereof
US7126230B2 · kind B2 · utility
0Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2004 |
| Grant date | Oct 24, 2006 |
| Priority date | — |
| Expiry date | Jun 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor electronic device is described comprising a die of semiconductor material having a plurality of contact pads electrically connected to a support for example through interposition of contact wires, said plurality of contact pads comprising signal pads and power pads, the device being characterized in that said signal pads are implemented on the die of semiconductor material with a mutual pitch lower than the pitch between said power pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.