Process of manufacturing multilayer modules
US7127807B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2003 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | Jun 27, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1092
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is disclosed for providing electrical connections to electronic elements within a multilayer module. The method includes providing first and second active layers having first and second edges, respectively. Each active layer includes a flexible, polymer substrate and at least one electronic element formed within the substrate. Electrically-conductive traces provide electrical connections from the first and second edges to the electronic elements. An adhesive is applied to at least one of a top surface of the first active layer and a bottom surface of the second active layer and the top surface of the first active layer is adhered to the bottom surface of the second active layer. The first edge and the second edge are aligned with each other thereby forming a side of the multilayer module. Electrically-conductive lines are applied along the side of the multilayer module to provide electrical connections to the traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.