Method of dividing a semiconductor wafer
US7129150B2 · kind B2 · utility
123Cited by
17References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 8, 2004 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | May 17, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/02
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of dividing a semiconductor wafer comprising:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.