Tetrafluoroethylene based resin molding material excellent in high frequency electric characteristics
US7129298B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2001 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | Nov 26, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/3154
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a TFE resin molding material which has electric characteristics, particularly low dielectric dissipation factor, in a microwave area, can also lower extrusion pressure as the material is of low molecular weight and can provide a molded article excellent in surface smoothness. The material is especially useful as a coating material for a coaxial cable for equipment in which microwave is used, including satellite transmitting equipment and a cell phone base station. A tetrafluoroethylene resin molding material excellent in high frequency electric characteristics, which provides a molded article having a dielectric constant of at most 2.2 and a dielectric dissipation factor of at most 1.60×10−4 under 12 GHz, and a standard specific gravity of at least 2.192 and less than 2.3 is provided. As the tetrafluoroethylene resin, a tetrafluoroethylene homopolymer or a copolymer of 99.9 to 99.9999% by mole of tetrafluoroethylene and 0.0001 to 0.1% by mole of a specific fluoromonomer is used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.