Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
US7129581B2 · kind B2 · utility
6Cited by
10References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 15, 2004 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | Dec 15, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is provided comprising: a semiconductor element including a plurality of electrodes; a plurality of resin layers; a plurality of wirings; and a plurality of external terminals coupled to the wirings. First wirings of the plural wirings are formed at the bottom of a first resin layer and second wirings are formed at the top of the first resin layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.