Haruki Ito
53Patents
12h-index
23Co-inventors
84Inventor score
Filing activity: Jan 12, 1990 → Jul 27, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6608371B2 | Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment | Electricity | 165 | Expired |
| US6667551B2 | Semiconductor device and manufacturing thereof, including a through-hole with a wider intermediate cavity | Electricity | 140 | Expired |
| US7098127B2 | Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment | Electricity | 77 | Expired |
| US6852621B2 | Semiconductor device and manufacturing method therefor, circuit board, and electronic equipment | Electricity | 58 | Expired |
| US6707153B2 | Semiconductor chip with plural resin layers on a surface thereof and method of manufacturing same | Electricity | 45 | Expired |
| US7246432B2 | Method of manufacturing semiconductor device | Emerging Cross-Sectional Technologies | 42 | Active |
| US5439896A | Thermosetting powdery coating composition | Emerging Cross-Sectional Technologies | 41 | Expired |
| US6325431A | Roll-formed product and vehicle bumper using the same | Performing Operations; Transporting | 26 | Expired |
| US6940160B1 | Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument | Electricity | 24 | Expired |
| US7495331B2 | Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus | Electricity | 13 | Active |
| US5147934A | Thermosetting powdery coating composition | Emerging Cross-Sectional Technologies | 13 | Expired |
| US8294260B2 | Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus | Electricity | 12 | Active |
| US7528476B2 | Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument | Electricity | 10 | Active |
| US7566584B2 | Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method | Emerging Cross-Sectional Technologies | 6 | Active |
| US7679153B2 | Sealed surface acoustic wave element package | Electricity | 6 | Active |
| US7982310B2 | Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus | Electricity | 6 | Active |
| US7129581B2 | Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus | Electricity | 6 | Expired |
| US7851265B2 | Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus | Electricity | 5 | Active |
| US7365561B2 | Test probe and tester, method for manufacturing the test probe | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6488788B2 | Flat plate member with a gear portion and a process for making the same | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7276792B2 | Semiconductor device, circuit substrate, electro-optic device and electronic appliance | Electricity | 3 | Expired |
| US7830007B2 | Electronic device, method of producing the same, and semiconductor device | Electricity | 3 | Active |
| US5051273A | Method of preparation of a patterned decorative material | Performing Operations; Transporting | 3 | Expired |
| US9863828B2 | Physical quantity sensor, electronic device, altimeter, electronic apparatus, and mobile object | Electricity | 3 | Active |
| US7482541B2 | Panel for electro-optical apparatus, method of manufacture thereof, electro-optical apparatus and electronic apparatus | Emerging Cross-Sectional Technologies | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.