Methods and systems for inspection of an entire wafer surface using multiple detection channels
US7130036B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2003 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | Nov 16, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/95623
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods for inspecting a wafer are provided. One method includes directing light to a center portion and an edge portion of a wafer in a single scan. The method also includes detecting light scattered from the center portion using a first detection channel and detecting light scattered from the edge portion using a second detection channel. Another method for inspecting an edge portion of a wafer includes scanning the edge portion of the wafer with light. The method also includes separately detecting different portions of light scattered from the edge portion. In addition, the method includes separating light scattered from edge features in the edge portion from other light scattered from the edge portion. The method further includes detecting defects in the edge portion of the wafer using the other scattered light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.