KLA-Tencor Technologies Corp.
639Patents
227Active
639Granted
54Portfolio score
Filing activity: Feb 22, 1995 → Nov 7, 2019 · 211 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6633831B2 | Methods and systems for determining a critical dimension and a thin film characteristic of a specimen | Emerging Cross-Sectional Technologies | 246 | Expired |
| US7570796B2 | Methods and systems for utilizing design data in combination with inspection data | Physics | 210 | Active |
| US7676077B2 | Methods and systems for utilizing design data in combination with inspection data | Electricity | 208 | Active |
| US6751519B1 | Methods and systems for predicting IC chip yield | Electricity | 181 | Expired |
| US6483580B1 | Spectroscopic scatterometer system | Electricity | 172 | Expired |
| US6288780A | High throughput brightfield/darkfield wafer inspection system using advanced optical techniques | Physics | 127 | Expired |
| US8179530B2 | Methods and systems for determining a critical dimension and overlay of a specimen | Electricity | 127 | Active |
| US6694284B1 | Methods and systems for determining at least four properties of a specimen | Electricity | 120 | Expired |
| US7138640B1 | Method and apparatus for protecting surfaces of optical components | Physics | 117 | Expired |
| US6891627B1 | Methods and systems for determining a critical dimension and overlay of a specimen | Electricity | 117 | Expired |
| US7525649B1 | Surface inspection system using laser line illumination with two dimensional imaging | Physics | 115 | Active |
| US7068363B2 | Systems for inspection of patterned or unpatterned wafers and other specimen | Physics | 112 | Expired |
| US6486954B1 | Overlay alignment measurement mark | Physics | 109 | Expired |
| US7280945B1 | Apparatus and methods for detection of systematic defects | Physics | 105 | Expired |
| US7893703B2 | Systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer | Electricity | 103 | Active |
| US6734967B1 | Focused beam spectroscopic ellipsometry method and system | Physics | 103 | Expired |
| US6861666B1 | Apparatus and methods for determining and localization of failures in test structures using voltage contrast | Physics | 99 | Expired |
| US6902855B2 | Qualifying patterns, patterning processes, or patterning apparatus in the fabrication of microlithographic patterns | Physics | 91 | Expired |
| US7656170B2 | Multiple directional scans of test structures on semiconductor integrated circuits | Electricity | 89 | Active |
| US7067335B2 | Apparatus and methods for semiconductor IC failure detection | Physics | 88 | Expired |
| US6897444B1 | Multi-pixel electron emission die-to-die inspection | Electricity | 88 | Expired |
| US7514681B1 | Electrical process monitoring using mirror-mode electron microscopy | Electricity | 86 | Active |
| US7198963B2 | Methodologies for efficient inspection of test structures using electron beam scanning and step and repeat systems | Physics | 84 | Expired |
| US7242477B2 | Apparatus and methods for detecting overlay errors using scatterometry | Physics | 83 | Expired |
| US7705331B1 | Methods and systems for providing illumination of a specimen for a process performed on the specimen | Physics | 80 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.