Manifold-Distributed Air Flow Over Removable Test Boards in a Memory-Module Burn-In System With Heat Chamber Isolated by Backplane
US7131040B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2005 |
| Grant date | Oct 31, 2006 |
| Priority date | — |
| Expiry date | May 28, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2029/2602
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Hot air blown past memory modules under test in a heat chamber is improved. Hot air entering the chamber from an inlet pipe is split by a manifold and deflectors. Holes in the manifold allow for a relatively even air distribution within the chamber, minimizing temperature variations. Return air is collected by a heat-chamber bottom cover into a return pipe. A heating unit re-heats the return air and blows it into the inlet pipe. One side of the heat chamber is an insulated backplane. Memory modules are inserted into sockets on module motherboards, which are inserted into motherboard sockets on the backplane. On the other side of the backplane, card sockets receive pattern-generator cards outside the heat chamber but electrically connected to the module motherboards through the backplane. The pattern-generator cards exercise the memory modules. The pattern-generator cards are cooled while memory modules in the heat chamber are heated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.