Heat-shrinkable retainer for PCB double-sided assembly
US7131193B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2004 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | Apr 24, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49153
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. The retainer includes a heat-shrinkable member and a retaining member. Being formed from a heat-shrinkable material, the heat-shrinkable member is configured to receive a post extending through an opening formed in a double-sided printed circuit board from a component previously assembled on one side thereof. The retaining member is coupled with the heat-shrinkable member, and the double-sided printed circuit board is disposed substantially between the retaining member and the component. The heat-shrinkable member is configured to shrinkably engage the post when an opposite side of the double-sided printed circuit board is populated and reflowed, retaining the inverted component on the double-sided printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.