Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers
US7131487B2 · kind B2 · utility
11Cited by
22References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2001 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | Apr 25, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An apparatus for cooling heat producing devices is disclosed. In one embodiment, the apparatus includes a heat absorber attached to a first end of a base. Both the base and the heat absorber may be formed of a thermally conductive material, and a width of the heat absorber is greater than a width of the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.