Anisotropic conductivity connector, conductive paste composition, probe member, and wafer inspection device, and wafer inspecting method
US7131851B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2003 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | Aug 7, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/714
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a wafer can be conducted with ease even when the wafer has a large area of 8 inches or greater in diameter, and the pitch of electrodes to be inspected is small, and good conductivity is retained even upon repeated use, and applications thereof. The anisotropically conductive connector has a frame plate, in which a plurality of anisotropically conductive film-arranging holes have been formed correspondingly to electrode regions in all or part of integrated circuits on a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes. The elastic anisotropically conductive films each have a plurality of conductive parts for connection extending in a thickness-wise direction thereof and containing conductive particles, and an insulating part mutually insulating them. The conductive particles are obtained by coating core particles exhibiting magnetism with a high-conductive metal, a proportion of the high-conductive metal to the core particles is at least 15% by mass, and the following t is at least …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.