Method of manufacturing polishing pad
US7132070B2 · kind B2 · utility
7Cited by
19References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2003 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | May 27, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B27/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a polishing pad is described. A mold having a mold cavity therein is provided. At least a strip is buried in the mold. A polymer foam material is injected into the mold cavity of the mold. The polymer foam material is cured to mold the polymer foam material into a molding polymer article. A mold release process is performed to obtain the molding polymer article. The strip on the molding article is removed to form a polishing pad having at least one groove thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.