Semiconductor chip assembly with carved bumped terminal
US7132741B1 · kind B1 · utility
27Cited by
146References
100Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2004 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | May 26, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal filler, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line is contiguous with and integral with the bumped terminal and extends laterally beyond the bumped terminal and the metal filler, and the metal filler contacts the bumped terminal in a cavity that extends through the bumped terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.