Method and apparatus for sealing a liquid cooled electronic device
US7133286B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2004 |
| Grant date | Nov 7, 2006 |
| Priority date | — |
| Expiry date | Apr 6, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus is disclosed for liquid cooling an electronic device without wetting underside hardware of the electronic device and a substrate to which it is attached. In an exemplary embodiment, an electronic module substrate assembly includes a substrate, an electronic device electrically connected to the substrate, and an elastomer barrier. The barrier includes a cutout configured to sealably affix to chip edges defining the electronic device. The cutout provides fluid communication to a back surface of the electronic device exposed through the cutout while the barrier seals the substrate from such fluid communication.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.