In-wafer testing of integrated optical components in photonic integrated circuits (PICs)
US7135382B2 · kind B2 · utility
6Cited by
15References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2004 |
| Grant date | Nov 14, 2006 |
| Priority date | — |
| Expiry date | Dec 16, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4087
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is a method of in-wafer testing of integrated optical components and in-wafer chips with photonic integrated circuits (PICs).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.