Method and apparatus for end-point detection
US7136173B2 · kind B2 · utility
3Cited by
24References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 3, 2001 |
| Grant date | Nov 14, 2006 |
| Priority date | — |
| Expiry date | Nov 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/7684
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for detecting the end-point of an electropolishing process of a metal layer formed on a wafer (1004) includes an end-point detector. The end-point detector is disposed adjacent the nozzle (1008) used to electropolish the wafer. In one embodiment, the end-point detector is configured to measure the optical reflectivity of the portion of the wafer being electropolished.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.