Optical printed circuit board and optical interconnection block using optical fiber bundle
US7136551B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 1, 2005 |
| Grant date | Nov 14, 2006 |
| Priority date | — |
| Expiry date | Mar 1, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0274
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is an optical printed circuit board (PCB) having a multi-channel optical waveguide, which comprises: an optical waveguide having an optical path for transmitting light beams; a groove for penetrating the optical waveguide; and an optical interconnection block inserted in the groove and connected to the optical waveguide to transmit the light beams, wherein the optical interconnection block includes an optical fiber bundle bent by the angle of 90°. The optical interconnection block connects a plurality of multi-layered optical waveguides to transmit light beams to the optical waveguides. The optical fiber bundle is installed as a medium of the multi-channel optical waveguide in the optical PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.