Pattern component analysis and manipulation
US7137098B2 · kind B2 · utility
1Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2004 |
| Grant date | Nov 14, 2006 |
| Priority date | — |
| Expiry date | Apr 2, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/70
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for determining component patterns of a raw substrate map. A subset of substrate patterns is selected from a set of substrate patterns, and combined into a composite substrate map. The substrate patterns are weighted. The composite substrate map is compared to the raw substrate map, and a degree of correlation between the composite substrate map and the raw substrate map is determined. The steps are iteratively repeated until the degree of correlation is at least a desired degree, and the weighted subset of substrate patterns is output as the component patterns of the raw substrate map.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.