Patent · US Expired

Integrated flexure mount scheme for dynamic isolation of ultrasonic transducers

US7137543B2 · kind B2 · utility

11Cited by
12References
27Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 28, 2004
Grant dateNov 21, 2006
Priority date
Expiry dateDec 15, 2024

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2224/78308
  • WIPO fieldChemical engineering
  • WIPO sectorChemistry

Abstract

The present invention is directed to an integrated flexure mount scheme for dynamic isolation of ultrasonic transducers for use with a wire bonding machine. The transducer has a body of a generally elongated shape having front, rear, and main portions. The transducer has mounting flanges for mounting the transducer to the wire bonding machine. The mounting flanges have at least two integrated flexures that connect the mounting flange to the main portion of the transducer body and define at least one flexure orifice.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.