Patent · US Expired

Silicon tube formed of bonded staves

US7137546B2 · kind B2 · utility

2Cited by
18References
26Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 15, 2003
Grant dateNov 21, 2006
Priority date
Expiry dateAug 15, 2023

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/13
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Tubular silicon members advantageously formed by extrusion from a silicon melt or by fixing together silicon staves in a barrel shape. A silicon-based wafer support tower is particularly useful for batch-mode thermal chemical vapor deposition and other high-temperature processes, especially reflow of silicate glass at above 1200° C. The surfaces of the silicon tower are bead blasted to introduce sub-surface damage, which produces pits and cracks in the surface, which anchor subsequently deposited layer of, for example, silicon nitride, thereby inhibiting peeling of the nitride film. Wafer support portions of the tower are preferably composed of virgin polysilicon. The invention can be applied to other silicon parts in a deposition or other substrate processing reactor, such as tubular sleeves and reactor walls. The tower parts are preferably pre-coated with silicon nitride or polysilicon prior to chemical vapor deposition of these materials, or with silicon nitride prior to reflow of silica.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.