Temperature dependent semiconductor module connectors
US7137826B2 · kind B2 · utility
5Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2005 |
| Grant date | Nov 21, 2006 |
| Priority date | — |
| Expiry date | Mar 8, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.