Washing liquid composition for semiconductor substrate
US7138362B2 · kind B2 · utility
12Cited by
8References
12Claims
0Family size
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Inventors
Key dates
| Filing date | Feb 19, 2003 |
| Grant date | Nov 21, 2006 |
| Priority date | — |
| Expiry date | Jun 25, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
There is provided a washing liquid composition for a semiconductor substrate having a contact angle between the surface thereof and water dropped thereon of at least 70 degrees, the washing liquid composition including an aliphatic polycarboxylic acid and a surfactant, and the washing liquid composition having a contact angle of at most 50 degrees when dropped on the semiconductor substrate. It is thereby possible to effectively remove particles and metals on the surface of a hydrophobic substrate without corroding it.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.