Barrier layers for microelectromechanical systems
US7138693B2 · kind B2 · utility
4Cited by
2References
80Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2004 |
| Grant date | Nov 21, 2006 |
| Priority date | — |
| Expiry date | Feb 5, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/053
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for processing microelectromechanical devices is disclosed herein. The method prevents the diffusion and interaction between sacrificial layers and structure layers of the microelectromechanical devices by providing selected barrier layers between consecutive sacrificial and structure layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.