Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
US7139172B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2004 |
| Grant date | Nov 21, 2006 |
| Priority date | — |
| Expiry date | Jun 17, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices having a non-uniform power density distribution, which are mounted face down on a package substrate. For example, integrated microchannel cooler devices (or microchannel heat sink devices) for cooling IC chips are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths, as well as provide variable localized cooling capabilities for high power density regions (or “hot spots”) of IC chips with higher than average power densities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.