John Harold Magerlein
33Patents
13h-index
59Co-inventors
80Inventor score
Filing activity: Dec 19, 1997 → Dec 7, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7990711B1 | Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate | Electricity | 98 | Active |
| US7190580B2 | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages | Electricity | 63 | Expired |
| US6593644B2 | System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing face | Electricity | 58 | Expired |
| US7139172B2 | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages | Electricity | 55 | Expired |
| US7928562B2 | Segmentation of a die stack for 3D packaging thermal management | Electricity | 49 | Active |
| US7808781B2 | Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements | Electricity | 32 | Active |
| US7202764B2 | Noble metal contacts for micro-electromechanical switches | Emerging Cross-Sectional Technologies | 31 | Expired |
| US8110415B2 | Silicon based microchannel cooling and electrical package | Electricity | 27 | Active |
| US6819000B2 | High density area array solder microjoining interconnect structure and fabrication method | Electricity | 22 | Expired |
| US7518229B2 | Versatile Si-based packaging with integrated passive components for mmWave applications | Electricity | 21 | Active |
| US7808798B2 | Versatile Si-based packaging with integrated passive components for mmWave applications | Electricity | 21 | Active |
| US6774482B2 | Chip cooling | Electricity | 20 | Expired |
| US8115303B2 | Semiconductor package structures having liquid coolers integrated with first level chip package modules | Electricity | 18 | Active |
| US7189595B2 | Method of manufacture of silicon based package and devices manufactured thereby | Electricity | 10 | Expired |
| US8772927B2 | Semiconductor package structures having liquid cooler integrated with first level chip package modules | Electricity | 9 | Active |
| US6661098B2 | High density area array solder microjoining interconnect structure and fabrication method | Electricity | 9 | Expired |
| US7473102B2 | Space transforming land grid array interposers | Electricity | 9 | Expired |
| US6732908B2 | High density raised stud microjoining system and methods of fabricating the same | Electricity | 8 | Expired |
| US7638406B2 | Method of fabricating a high Q factor integrated circuit inductor | Electricity | 8 | Active |
| US7068138B2 | High Q factor integrated circuit inductor | Electricity | 8 | Expired |
| US8581392B2 | Silicon based microchannel cooling and electrical package | Electricity | 7 | Active |
| US7855442B2 | Silicon based package | Electricity | 7 | Active |
| US7581314B2 | Method of forming noble metal contacts | Emerging Cross-Sectional Technologies | 5 | Active |
| US8097492B2 | Method and manufacture of silicon based package and devices manufactured thereby | Electricity | 5 | Active |
| US6747472B2 | Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same | Electricity | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.