Substrate processing unit, method for detecting the position of a substrate and substrate processing apparatus
US7139638B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2004 |
| Grant date | Nov 21, 2006 |
| Priority date | — |
| Expiry date | May 26, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal processing unit is connected to a substrate position detector, which is in turn connected to a bake unit controller. The thermal processing unit includes a temperature control plate and a lifting device. The temperature control plate and lifting device are connected to the bake unit controller. The operations of the temperature control plate and lifting device are controlled by the bake unit controller. A pressure measuring pipe is provided at a lower part of at least one of a plurality of pin inserting holes in the temperature control plate. The pressure measuring pipe is connected to a low differential pressure sensor. The low differential pressure sensor detects the pressure in an airflow exhausted from a space surrounded by a substrate and an upper face of the temperature control plate via the pressure measuring pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.