Methods and apparatuses for assembling elements onto a substrate
US7141176B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2002 |
| Grant date | Nov 28, 2006 |
| Priority date | — |
| Expiry date | Aug 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/60
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatuses for assembling elements onto a substrate. The surfaces of the elements and/or the substrate are treated and the elements are dispensed over the substrate in a slurry. In one example of the invention, the substrate is exposed to a surface treatment fluid to create a surface on the substrate which has a selected one of a hydrophilic or a hydrophobic nature, and a slurry is dispensed over the substrate. The slurry includes a fluid and a plurality of elements (each of which includes a functional component). Each of the plurality of elements is designed to be received by a receptor region on the substrate. The dispensing of the slurry with the fluid occurs after the substrate is exposed to the surface treatment fluid, and the fluid is the selected one of a hydrophilic or a hydrophobic nature. In another example of the invention, a plurality of elements is exposed to a surface treatment fluid to create surfaces on the elements having a selected one of a hydrophilic or a hydrophobic nature. A slurry is dispensed over a substrate, wherein the slurry contains a fluid and the plurality of elements which are designed to be received by a plurality of receptor regions. T…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.