Wiring-connecting material and wiring-connected board production process using the same
US7141645B2 · kind B2 · utility
17Cited by
9References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 2004 |
| Grant date | Nov 28, 2006 |
| Priority date | — |
| Expiry date | May 17, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.